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Direct-to-chip cooling and rear-door heat exchangers. We help you select the right cold plates, CDUs, manifolds, and connections for your loop.
01 / Direct-to-chip cooling
Cold plates, CDUs, and manifolds that transfer chip heat to the facility loop. CDU options range from 70 kW rack units to shared cooling systems up to 2–3 MW.
02 / Rear-door HX
Liquid-to-air heat exchanger on the rack door. Capture heat before it hits the room. Retrofit existing halls with no IT changes.
03 / Immersion
Single-phase tanks for full server immersion. High density, near-silent, no rack fans.
Not sure what you need?
GPU model, rack count, and target density. We'll size the loop and quote the parts.